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VN610SP 数据表(PDF) 8 Page - STMicroelectronics

部件名 VN610SP
功能描述  SINGLE CHANNEL HIGH SIDE SOLID STATE RELAY
PDF  10 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

VN610SP 数据表(HTML) 8 Page - STMicroelectronics

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VN610SP
GND
PROTECTION
NETWORK
AGAINST
REVERSE BATTERY
Solution 1: Resistor in the ground line (RGND only). This
can be used with any type of load.
The following is an indication on how to dimension the
RGND resistor.
1) RGND ≤ 600mV / (IS(on)max).
2) RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can
be found in the absolute maximum rating section of the
device’s datasheet.
Power Dissipation in RGND (when VCC<0: during reverse
battery situations) is:
PD= (-VCC)
2/R
GND
This resistor can be shared amongst several different
HSD. Please note that the value of this resistor should be
calculated with formula (1) where IS(on)max becomes the
sum of the maximum on-state currents of the different
devices.
Please note that if the microprocessor ground is not
common with the device ground then the RGND will
produce a shift (IS(on)max *RGND) in the input thresholds
and the status output values. This shift will vary
depending on how many devices are ON in the case of
several high side drivers sharing the same RGND.
If the calculated power dissipation leads to a large resistor
or several devices have to share the same resistor then
the ST suggests to utilize Solution 2 (see below).
Solution 2: A diode (DGND) in the ground line.
A resistor (RGND=1kΩ) should be inserted in parallel to
DGND if the device will be driving an inductive load.
This small signal diode can be safely shared amongst
several different HSD. Also in this case, the presence of
the ground network will produce a shift (j 600mV) in the
input threshold and the status output values if the
microprocessor ground is not common with the device
ground. This shift will not vary if more than one HSD
shares the same diode/resistor network.
LOAD DUMP PROTECTION
Dld is necessary (Transil or MOV) if the load dump peak
voltage exceeds VCC max DC rating. The same applies if
the device will be subject to transients on the VCC line that
are greater than the ones shown in the ISO T/R 7637/1
table.
µC I/Os PROTECTION:
If a ground protection network is used and negative
transients are present on the VCC line, the control pins will
be pulled negative. ST suggests to insert a resistor (Rprot)
in line to prevent the
µC I/Os pins to latch-up.
The value of these resistors is a compromise between the
leakage current of
µC and the current required by the
HSD I/Os (Input levels compatibility) with the latch-up limit
of
µC I/Os.
-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHµC-VIH-VGND)/ IIHmax
Calculation example:
For VCCpeak= - 100V and Ilatchup ≥ 20mA; VOHµC ≥ 4.5V
5k
Ω ≤ R
prot ≤ 10kΩ.
Recommended Rprot value is 65kΩ.
1
APPLICATION SCHEMATIC
1
1
VCC
GND
OUTPUT
DGND
RGND
Dld
µC
+5V
Rprot
VGND
INPUT
+5V
CURRENT SENSE
RSENSE
Rprot



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