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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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VNQ830 数据表(PDF) 16 Page - STMicroelectronics |
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VNQ830 数据表(HTML) 16 Page - STMicroelectronics |
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16 / 20 page  16/20 VNQ830 SO-28 Double island PC Board Thermal calculation according to the PCB heatsink area RthA = Thermal resistance Junction to Ambient with one chip ON RthB = Thermal resistance Junction to Ambient with both chips ON and Pdchip1=Pdchip2 RthC = Mutual thermal resistance Rthj-amb Vs. PCB copper area in open box free air condition Chip 1 Chip 2 Tjchip1 Tjchip2 Note ON OFF RthA x Pdchip1 + Tamb RthC x Pdchip1 + Tamb OFF ON RthC x Pdchip2 + Tamb RthA x Pdchip2 + Tamb ON ON RthB x (Pdchip1 + Pdchip2) + Tamb RthB x (Pdchip1 + Pdchip2) + Tamb Pdchip1=Pdchip2 ON ON (RthA x Pdchip1) + RthC x Pdchip2 + Tamb (RthA x Pdchip2) + RthC x Pdchip1 + Tamb Pdchip1≠Pdchip2 SO-28 DOUBLE ISLAND THERMAL DATA Layout condition of Rth and Zth measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm, Cu thickness=35 µm, Copper areas: 0.5cm2, 3cm2, 6cm2). 10 20 30 40 50 60 70 01 2345 6 7 PCB Cu heats ink area (cm ^2)/island RTHj_am b (°C/W) RthA RthB RthC |
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