14

LT1007/LT1037

sn100737 100737fbs

H Package

8-Lead TO-5 Metal Can (.200 Inch PCD)

(Reference LTC DWG # 05-08-1320)

J8 Package

8-Lead CERDIP (Narrow .300 Inch, Hermetic)

(Reference LTC DWG # 05-08-1110)

45

°TYP

0.050

(1.270)

MAX

0.016 – 0.021**

(0.406 – 0.533)

0.010 – 0.045*

(0.254 – 1.143)

SEATING

PLANE

0.040

(1.016)

MAX

0.165 – 0.185

(4.191 – 4.699)

GAUGE

PLANE

REFERENCE

PLANE

0.500 – 0.750

(12.700 – 19.050)

0.305 – 0.335

(7.747 – 8.509)

0.335 – 0.370

(8.509 – 9.398)

DIA

0.200

(5.080)

TYP

0.027 – 0.045

(0.686 – 1.143)

0.027 – 0.034

(0.686 – 0.864)

0.110 – 0.160

(2.794 – 4.064)

INSULATING

STANDOFF

H8(TO-5) 0.200 PCD 0595

LEAD DIAMETER IS UNCONTROLLED BETWEEN THE REFERENCE PLANE

AND 0.045" BELOW THE REFERENCE PLANE

FOR SOLDER DIP LEAD FINISH, LEAD DIAMETER IS

0.016 – 0.024

(0.406 – 0.610)

*

**

J8 1298

0.014 – 0.026

(0.360 – 0.660)

0.200

(5.080)

MAX

0.015 – 0.060

(0.381 – 1.524)

0.125

3.175

MIN

0.100

(2.54)

BSC

0.300 BSC

(0.762 BSC)

0.008 – 0.018

(0.203 – 0.457)

0

° – 15°

0.005

(0.127)

MIN

0.405

(10.287)

MAX

0.220 – 0.310

(5.588 – 7.874)

12

3

4

87

65

0.025

(0.635)

RAD TYP

0.045 – 0.068

(1.143 – 1.727)

FULL LEAD

OPTION

0.023 – 0.045

(0.584 – 1.143)

HALF LEAD

OPTION

CORNER LEADS OPTION

(4 PLCS)

0.045 – 0.065

(1.143 – 1.651)

NOTE: LEAD DIMENSIONS APPLY TO SOLDER DIP/PLATE

OR TIN PLATE LEADS

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