14

LT1395/LT1396/LT1397

139567fc

GN16 (SSOP) 0204

12

3

4

5

6

7

8

.229 – .244

(5.817 – 6.198)

.150 – .157**

(3.810 – 3.988)

16 15 14 13

.189 – .196*

(4.801 – 4.978)

12 11 10 9

.016 – .050

(0.406 – 1.270)

.015

± .004

(0.38

± 0.10)

× 45°

0

° – 8° TYP

.007 – .0098

(0.178 – 0.249)

.0532 – .0688

(1.35 – 1.75)

.008 – .012

(0.203 – 0.305)

TYP

.004 – .0098

(0.102 – 0.249)

.0250

(0.635)

BSC

.009

(0.229)

REF

.254 MIN

RECOMMENDED SOLDER PAD LAYOUT

.150 – .165

.0250 BSC

.0165

±.0015

.045

±.005

INCHES

(MILLIMETERS)

NOTE:

1. CONTROLLING DIMENSION: INCHES

2. DIMENSIONS ARE IN

3. DRAWING NOT TO SCALE

*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH

SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE

**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD

FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE

PACKAGE DESCRIPTIO

GN Package

16-Lead Plastic SSOP (Narrow .150 Inch)

(Reference LTC DWG # 05-08-1641)

3.00

±0.10

(2 SIDES)

4.00

±0.10

(2 SIDES)

NOTE:

1. DRAWING PROPOSED TO BE MADE VARIATION OF

VERSION (WGED-3) IN JEDEC PACKAGE OUTLINE MO-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE

TOP AND BOTTOM OF PACKAGE

0.40

± 0.10

BOTTOM VIEW—EXPOSED PAD

1.70

± 0.05

(2 SIDES)

0.75

±0.05

R = 0.115

TYP

R = 0.05

TYP

3.30

±0.05

(2 SIDES)

1

7

14

8

(SEE NOTE 6)

PIN 1

TOP MARK

0.200 REF

0.00 – 0.05

(DE14) DFN 0905 REV A

0.25

± 0.05

PIN 1

NOTCH

R = 0.20 OR

0.35

× 45°

CHAMFER

0.50 BSC

3.30

±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

1.70

±0.05

(2 SIDES)

2.20

±0.05

0.50

BSC

0.70

±0.05

3.60

±0.05

PACKAGE

OUTLINE

0.25

± 0.05

DE Package

14-Lead Plastic DFN (4mm

× 3mm)

(Reference LTC DWG # 05-08-1708 Rev B)