3-58

TELCOM SEMICONDUCTOR, INC.

5V PRECISION DATA ACQUISITION

SUBSYSTEMS

TC530

TC534

Figure 6. TC530/534 Typical Application

A0

A1

RESET

EOC

VCCD

VCCD

VDD

VDD

D

OUT

D

CLK

X1: 2MHz

R2

100k

R1

100k

100

Ω

1

µF

TC04

(1.03V)

D

IN

R/W

ACOM

OSC

IN

OSC

OUT

V

SS

DGND

C

AZ

C

AZ

0.22

µF

C

IN

0.33

µF

R

100k

TC534

C

INT

Analog

Inputs

Channel

Control

C1

.01

µF

10

µF

MUX

IN1

+

IN1

–

IN2

+

IN2

–

IN3

+

IN3

–

IN4

+

IN4

–

+5V

+5V

–5V

(Optional)

BUF

V

REF

+

V

REF

–

+

C

REF

C

REF

–

C

REF

0.22

µF

+

CAP

1

µF

+5V

INT

PROCESSOR

I/O

I/O

I/O

I/O

.01

µF

.01

µF

1

µF

3. Calculate LOAD VALUE

put swing

= .32

µF (use closest value: 0.33µF)

NOTE: TelCom recommended capacitor:

WIMA p/n: MK12 .33/63/10

= 1/(66msec + 66msec + 132msec

+ 2msec)

= 3.7 conversions/sec

NOTE: TelCom recommended capacitor:

WIMA p/n: MK12 .22/63/10

= 1.025V

Power Supply Sequencing

sequence to occur. See

Circuit Design/Layout Consider-

ations below. Failing to insure a proper power-up sequence

can cause spurious operation.

Ciruit Design/Layout Considerations

(1) Separate ground return paths should be used for the

analog and digital circuitry. Use of ground planes and trace

fill on analog circuit sections is highly recommended

EXCEPT for in and around the integrator section and

tween these nodes and ground appears in parallel with the

components themselves and can affect measurement accu-

racy.