LT3003

5

3003fa

BLOCK DIAGRAM

Figure 1. Block Diagram

1

2

–

+

–

+

–

+

4

B1 B2 B3

LED1

PWM

0.5V

LED2

11

EXPOSED PAD

LED3

3

3V

5

SHDN

0.7V

9

OT1

7

PWM

LOGIC

THERMAL

SHUTDOWN

BIAS

BG

BG

125

°C

150

°C

OT2

3003 F01

8

6

–

+

10

–

+

B2

B1

B3

• Boost: Connect to System Ground

• Buck Mode: Connect to Inductor

• Buck-Boost Mode: Connect to Input Supply

Exposed Pad (Pin 11): GND. The ground for the IC should

be soldered to a continuous copper ground plane under

the LT3003 die. Soldering the Exposed Pad to the copper

ground plane under the device will reduce thermal resis-

tance and increase the power capability of the LT3003.

PIN FUNCTIONS