LTM4607

19

4607f

APPLICATIONS INFORMATION

Table 4. Boost Mode

DERATING CURVE

POWER LOSS CURVE

AIR FLOW (LFM)

HEATSINK

Figure 7, 9

12, 16

Figure 5

0

none

11.4

Figure 7, 9

12, 16

Figure 5

200

none

8.5

Figure 7, 9

12, 16

Figure 5

400

none

7.5

Figure 8, 10

12, 16

Figure 5

0

BGA Heatsink

11.0

Figure 8, 10

12, 16

Figure 5

200

BGA Heatsink

7.9

Figure 8, 10

12, 16

Figure 5

400

BGA Heatsink

7.1

Table 5. Buck Mode

DERATING CURVE

POWER LOSS CURVE

AIR FLOW (LFM)

HEATSINK

Figure 11, 13

12, 20

Figure 6

0

none

8.2

Figure 11, 13

12, 20

Figure 6

200

none

5.9

Figure 11, 13

12, 20

Figure 6

400

none

5.4

Figure 12, 14

12, 20

Figure 6

0

BGA Heatsink

7.5

Figure 12, 14

12, 20

Figure 6

200

BGA Heatsink

5.3

Figure 12, 14

12, 20

Figure 6

400

BGA Heatsink

4.8

HEATSINK MANUFACTURER

PART NUMBER

PHONE NUMBER

Wakefield Engineering

LTN20069

603-635-2800

Aaivd Thermalloy

375424B00034G

603-224-9988

as the junction temperature (which is in the μModule for most cases) and the power losses from all components are counted for calculations. It has to be

TYPICAL APPLICATIONS

AMBIENT TEMPERATURE (°C)

0

1

5

6

7

8

45

55

65

4607 F13

2

4

3

85

75

95

105

AMBIENT TEMPERATURE (°C)

0

1

5

6

7

8

45

55

65

4607 F14

2

4

3

85

75

95

105