OP07C, OP07D, OP07Y

PRECISION OPERATIONAL AMPLIFIERS

SLOS099B – OCTOBER 1983 – REVISED AUGUST 1996

2

POST OFFICE BOX 655303

OP07Y chip information

These chips, properly assembled, display characteristics similar to the OP07. Thermal compression or

ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive

epoxy or a gold-silicon preform.

CHIP THICKNESS: 15 TYPICAL

BONDING PADS: 4

× 4 MINIMUM

TJmax = 150°C

TOLERANCES ARE

± 10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

OUT

VCC –

VCC+

OFFSET N2

IN –

IN +

OFFSET N1

(4)

(6)

(7)

(8)

(2)

(3)

(1)

+

–

BONDING PAD ASSIGNMENTS

94

72

(4)

(6)

(7)

(8)

(2)

(3)

(1)