MPX2050

Sensors

Freescale Semiconductor

5

Pressure

On-Chip Temperature Compensation and Calibration

Figure 3 shows the minimum, maximum and typical output

characteristics of the MPX2050 series at 25

°C. The output is

directly proportional to the differential pressure and is

essentially a straight line.

The effects of temperature on Full-Scale Span and Offset

are very small and are shown under Operating

Characteristics.

Figure 3. Output versus Pressure Differential

Figure 4. Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the differential or gauge configuration

in the basic chip carrier (Case 344). A silicone gel isolates the

die surface and wire bonds from the environment, while

allowing the pressure signal to be transmitted to the silicon

diaphragm.

The MPX2050 series pressure sensor operating

characteristics and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media

other than dry air may have adverse effects on sensor

performance and long term reliability. Contact the factory for

information regarding media compatibility in your application.

kPa

PSI

40

35

30

25

15

10

5

0

-5

0

12.5

1.8

25

3.6

37.5

5.4

50

7.25

Offset

(Typ)

20

MAX

TYP

MIN

MPX2050

P1 > P2

Span

Range

(Typ)

Silicone

Die Coat

Wire Bond

Lead Frame

Die

Stainless Steel

Metal Cover

Epoxy

Case

RTV Die

Bond

P1

P2