MPX2100

Sensors

Freescale Semiconductor

5

Pressure

On-Chip Temperature Compensation and Calibration

Figure 3 shows the output characteristics of the

MPX2100 series at 25

°C. The output is directly proportional

to the differential pressure and is essentially a straight line.

The effects of temperature on Full-Scale Span and Offset

are very small and are shown under Operating

Characteristics.

Figure 3. Output versus Pressure Differential

Figure 4. Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the absolute sensing configuration

(right) and the differential or gauge configuration in the basic

chip carrier (Case 344). A silicone gel isolates the die surface

and wire bonds from the environment, while allowing the

pressure signal to be transmitted to the silicon diaphragm.

The MPX2100 series pressure sensor operating

characteristics and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media

other than dry air may have adverse effects on sensor

performance and long term reliability. Contact the factory for

information regarding media compatibility in your application.

kPa

PSI

40

35

30

25

15

10

5

0

-5

025

3.62

50

7.25

75

10.87

100

14.5

Offset

(Typ)

20

MAX

TYP

MIN

P1 > P2

Span

Range

(Typ)

Silicone Gel

Die Coat

Absolute

Die

P1

Metal Cover

Epoxy

Case

Absolute Element

P2

Lead Frame

Wire Bond

Die

Bond

Stainless Steel

Lead Frame

Wire Bond

Differential/Gauge

Die

Silicone Gel

Die Coat

Differential/Gauge

P2

Die

Bond

Epoxy

Case

Stainless Steel

Metal Cover

P1

Element