MPXC2011DT1

Rev 6, 10/2008

Freescale Semiconductor

© Freescale Semiconductor, Inc., 2006, 2008. All rights reserved.

Pressure

High Volume Sensor for Low

Pressure Applications

Freescale Semiconductor has developed a low cost, high volume, miniature

pressure sensor package which is ideal as a sub-module component or a

disposable unit. The unique concept of the Chip Pak allows great flexibility in

system design while allowing an economic solution for the designer. This new

chip carrier package uses Freescale Semiconductor's unique sensor die with its

piezoresistive technology, along with the added feature of on-chip, thin-film

temperature compensation and calibration.

NOTE: Freescale Semiconductor is also offering the Chip Pak package in

application-specific configurations, which will have an “SPX” prefix,

followed by a four-digit number, unique to the specific customer

Features

•

Low Cost

•

Integrated Temperature Compensation and Calibration

•

Ratiometric to Supply Voltage

•

Polysulfone Case Material (Medical, Class V Approved)

• Provided in Easy-to-Use Tape and Reel

NOTE: The die and wire bonds are exposed on the front side of the Chip Pak (pressure is applied to the backside of the device).

Front side die and wire protection must be provided in the customer's housing. Use caution when handling the devices

during all processes.

ORDERING INFORMATION

Device Name

Package Options

Case

No.

Pressure Type

Device Marking

Gauge

Differential

Absolute

MPXC2011DTI

Tape and Reel

423A

•

Date Code, Lot ID

MPXC2012DTI

Tape and Reel

423A

•

Date Code, Lot ID

MPXC2011DT1

Pressure Sensors

0 to 75 mmHG

(0 to 10 kPa)

MPXC2012DT1

CHIP PAK PACKAGE

MPXC2011DT1/MPXC2012DT1

CASE 423A-03

Application Examples

• Respiratory Diagnostics

• Air Movement Control

• Controllers

• Pressure Switching