ADS-118/118A

®

®

6

Electrically-insulating, thermally-conductive "pads" may be

installed underneath the package. Devices should be soldered

to boards rather than socketed, and of course, minimal air flow

over the surface can greatly help reduce the package

temperature.

In more severe ambient conditions, the package/junction

temperature of a given device can be reduced dramatically

(typically 35%) by using one of DATEL's HS Series heat sinks.

See Ordering Information for the assigned part number. See

page 1-183 of the DATEL Data Acquisition Components

Catalog for more information on the HS Series. Request

DATEL Application Note AN8, "Heat Sinks for DIP Data

Converters",

or contact DATEL directly, for additional information.

THERMAL REQUIREMENTS

All DATEL sampling A/D converters are fully characterized

and specified over operating temperature (case) ranges of

0 to +70°C and –55 to +125°C. All room temperature

of heat sinks or forced air cooling. Thermal impedance

figures for each device are listed in their respective

specification tables.

These devices do not normally require heat sinks, however,

standard precautionary design and layout procedures should

be used to ensure devices do not overheat. The ground and

power planes beneath the package, as well as all pcb signal

runs to and from the device, should be as heavy as possible

to help conduct heat away from the package.

Figure 5. FFT Analysis of ADS-118

Figure 6. ADS-118 Histogram and Differential Nonlinearity

0

–10

–20

–30

–40

–50

–60

–70

–80

–90

–100

–110

–120

–130

0

250

500

750

1

1.25

1.5

1.75

2

2.25

2.5

kHz

kHz

kHz

MHz

MHz

MHz

MHz

MHz

MHz

MHz

(fs = 5MHz, fin = 2.45MHz, Vin = –0.5dB, 4,096-point FFT)

Frequency

Digital Output Code

+0.67

–0.47

0

4096

0

4096

Digital Output Code

0