Absolute Maximum Ratings

Items

Symbol

Value

Unit

Power Dissipation at Tamb = 25

500 *

mW

Junction Temperature

175

Storage Temperature Range

-65 ~ +175

* Valid provided that leads at a distance of 10mm from case are kept at ambient temperature

Characteristic at Tamb = 25

Items

Symbol

Min.

Typ.

Max.

Unit

Thermal Resistance Junctiobn to Ambient Air

R JA

-

-

0.3 *

K / mW

-

-

1.1

V

* Valid provided that leads at a distance of 10mm from case are kept at ambient temperature

Mechanical Data

Items

Materials

Package

Mini MELF ( SOD-80 )

Case

Hermeticall Sealed Glass

Lead Finish

Solder Plating

http://www.SeCoSGmbH.com/

Any changing of specification will not be informed individual

510

15

20

25

30

50

V

40

30

20

10

0

Breakdown Characteristics

ZMM52 Series

mA

Test currrent

Iz=20mA

due to the ambient temperature.

500

Change in the power dissipation

250

200

50

100

150

200

Ta (

)

Ambient Temperature.

100

400

300

6

Dimensions in mm

MINI MELF (SOD-80)

01-Jun-2002 Rev. A

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