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03-07

Ultra-Miniature SMT Slides

Series SS3

Distinctive Characteristics

Compact dimensions and low profile allow high density mounting and close stacking

of PC boards.

Crisp actuation positively indicates circuit status.

Heat resistant resin allows vapor phase and

infrared convection reflow soldering.

Award-winning STC mechanism with benefits

unavailable in conventional mechanisms:

smoother, positive detent actuation, increased

contact stability, and unparalleled logic-level

reliability. (Additional STC details in Terms

and Acronyms in the Supplement section.)

Insert molded terminals lock out flux, solvents, and other

contaminants.

Metric terminal spacing for standard PC board grid (2.0mm x 2.0mm ).

Gull-wing terminals provide mechanical stability during soldering and simplified

solder joint inspection.

Packaged in tape-reel or partitioned tray. Tape-reel packaging meets EIA-481-2 Standard.

Coplanarity: all considered surfaces must lie between two parallel planes that are a maximum

distance apart of .0059” (0.15mm). (Additional coplanarity details in Terms and Acronyms in

the Supplement section.)

Actual Size