EMP312

UPDATED 04/04/2008

21.0 – 24.0 GHz Power Amplifier MMIC

Specifications are subject to change without notice.

Excelics Semiconductor, Inc. 310 De Guigne Drive, Sunnyvale, CA 94085

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Revised April 2008

ASSEMBLY DRAWING

The length of RF wires should be as short as possible. Use at least two wires between RF pad and 50 ohm line and

separate the wires to minimize the mutual inductance.

Chip size 2140 X 2650 microns

Chip Thickness: 75

±13 microns

PAD Dimensions: 100 x 100 microns

All Dimensions in Microns

CHIP OUTLINE