2

408-432-9100/www.impweb.com

© 2000 IMP, Inc.

Pin Configuration

Ordering Information

8

GND

1

TERM POWER

D Package

9NC

7

NC

10 NC

6

D4

11 D5

5

D3

12 D6

4

D2

13 D7

3

D1

14 D8

2

D0

15 NC

16 DISABLE

5115__02.eps

IMP5115

8

GND

1

TERM POWER

DW Package

9NC

7

NC

10 D5

6

D4

11 D6

5

D3

12 D7

4

D2

13 D8

3

D1

14 NC

2

D0

15 NC

16 DISABLE

5115__02a.eps

IMP5115

SO-16

SOWB-16

1

TERM POWER

PWP Package

7

D4

14 D6

8

HEAT SINK/GND

13 D5

9

NC

12 HEAT SINK/GND

10

GND

11 NC

6

D3

15 D7

5

D2

16 D8

4

D1

17 NC

3

D0

18 HEAT SINK/GND

2

HEAT SINK/GND

19 NC

20 DISABLE

5115_02b.eps

IMP5115

TSSOP-20

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b

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t

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Pe

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P

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5

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5

P

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5

2

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t

C

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O

S

S

T

c

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t

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a

l

P

n

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p

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2

,

l

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R

d

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T

3

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1

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_

5

1

1

5

Thermal Data

Continuous Termination Voltage . . . . . . . . . . . 10V

Continuous Output Voltage Range

. . . . . . . . 0V to 5.5V

Continuous Disable Voltage Range

. . . . . . . . 0V to 5.5V

Operating Junction Temperature . . . . . . . . . . 0

°C to 125°C

Storage Temperature Range . . . . . . . . . . . . . . –65

°C to 150°C

Lead Temperature (Soldering, 10 sec.) . . . . . . 300

°C

Note:

1. Exceeding these ratings could cause damage to the device. All

voltages are with respect to Ground. Currents are positive

into, negative out of the specified terminal.

D Package:

Thermal Resistance Junction-to-Ambient,

DW Package:

Thermal Resistance Junction-to-Ambient,

PWP Package:

Thermal Resistance Junction-to-Ambient,

The

device/pc-board system. All of the ambient airflow is assumed.

1

IMP5