NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

07.08.2008

C3 SERIES

9. SOLDERING AND MOUNTING :

soldering of large size products is discouraged. Recommended temperature profile for wave soldering is shown

seen by the circuit when immersed in the molten solder wave. Due to the risk of thermal damage to products, wave

9-2.2 Solder Wave :

Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature

9-1. Recommended PC Board Pattern

air soldering tools.

9-2.3 Soldering Iron (Figure 3) :

9-2.1 Lead Free Solder Re-flow :

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature (max)

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended.

Note :

9-2. Soldering

330

Over 2min.

Figure 2. Wave Soldering

Gradual

Cooling

Within 3s

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 3 secs.

d) 1.0mm tip diameter (max)

260

245

150

under mechanical stress as warping the board.

the mechanical stress to prevent failure.

Products shall be positioned in the sideway direction against

PC board should be designed so that products are not sufficient

Figure 3. Hand Soldering

Gradual

Cooling

Over 1min.

350

150

Preheating

Soldering

cooling

Natural

Preheating

Soldering

cooling

Natural

(max.)

(max.)

3s

10s

3.00

1.00

in Fig. 2

60~180s

Figure 1. Re-flow Soldering

60~150s

TP(260°C/10s max.)

Preheating

Soldering

cooling

Natural

Time(sec.)

20~40s

217

200

150

25

480s max.

CERAMIC CHIP INDUCTORS