NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 4

26.09.2008

CERAMIC CHIP INDUCTORS

C2 SERIES

8. RELIABILITY & TEST CONDITION :

Bending

40(1.575)

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

Flexture Strength

100(3.937)

45(1.772)

right conditions.

45(1.772)

20(.787)

Solder a chip on a test substrate, bend the substrate

by 3mm (0.118in) for 10secs and return.

TEST CONDITION

PERFORMANCE

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

More than 90% of the terminal electrode

6±1

seconds

60

seconds

Terminal Strength

Solderability

right conditions.

W

should be covered with new solder.

60

seconds

Preheating

240°C

150°C

3±1.0

seconds

cooling

Dipping

Natural

Solder Heat Resistance

Preheating

265°C

150°C

Dipping

cooling

Natural

For C Series :

Solder : Sn-Ag3.0-Cu0.5

Flux : Rosin

Dip Time : 3±1sec.

Preheat : 150°C, 60sec.

Solder Temperature : 240±5°C

Flux : Rosin

Dip Time : 6±1sec.

Preheat : 100~150°C, 60sec.

Solder : Sn-Ag3.0-Cu0.5

Solder Temperature : 265±3°C

Appearance : Cracks should not be allowed.

More than 75% of the terminal electrode

W

ITEM

0.2

1

2.0

8

1.0

5

6

7

1.0

1.5

2

3

4

0.6

0.5

1.0

> 25

Size

Force (Kfg)

Time (sec)

should be covered with new solder.