NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 6

01.04.2008

FERRITE CHIP INDUCTORS

L2 SERIES

9. SOLDERIND AND MOUNTING :

products, wave soldering of large size products is discouraged. Recommended temperature profile for wave soldering

seen by the circuit when immersed in the molten solder wave, typical at 230°C. Due to the risk of thermal damage to

9-2.2 Solder Wave :

Wave soldering is perhaps the most rigorous of surface mount soldering processes due to the steep rise in temperature

9-1. Recommended PC Board Pattern

air soldering tools.

9-2.3 Soldering Iron (Figure 3) :

9-2.1 Lead Free Solder Re-flow :

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for all

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

Recommended temperature profiles for re-flow soldering in Figure 1.

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

a) Preheat circuit and products to 150°C.

b) 350°C tip temperature (max)

60~120s

Figure 1. Re-flow Soldering

30~60s

c) Never contact the ceramic with the iron tip

a soldering iron must be employed the following precautions are recommended.

230

250 ~ 260

150

180

Preheating

Note :

9-2. Soldering

330

Over 2min.

Figure 2. Wave Soldering

Gradual

Cooling

Within 3s

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

f) Limit soldering time to 3 secs.

d) 1.0mm tip diameter (max)

Soldering

cooling

Natural

260

245

150

under mechanical stress as warping the board.

the mechanical stress to prevent failure.

Products shall be positioned in the sideway direction against

PC board should be designed so that products are not sufficient

Figure 3. Hand Soldering

Gradual

Cooling

Over 1min.

Time(sec.)

350

150

Preheating

Soldering

cooling

Natural

Preheating

Soldering

cooling

Natural

(max.)

(max.)

3s

10s

10s max.

2.60

0.60

is shown in Fig. 2