SUPERWORLD ELECTRONICS (S) PTE LTD

NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 5

05.05.2008

HIGH CURRENT POWER INDUCTORS

SDL1108 SERIES

9. SOLDERIND AND MOUNTING :

Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that

e) Use a 20 watt soldering iron with tip diameter of 1.0mm

Styrofoam

Inner box

Carton

Size

2100

420

SDL1108

210

10. PACKING AND QUANTITY :

9-2.2 Soldering Iron (Figure 2) :

b) 280°C tip temperature (max)

Natural

cooling

30~60s

Figure 1. Re-flow Soldering

a soldering iron must be employed the following precautions are recommended.

a) Preheat circuit and products to 150°C.

c) Never contact the ceramic with the iron tip

150

180

60~120s

Preheating

250~260

230

Soldering

10s max.

Note :

260

Over 1min.

Within 3secs.

Figure 2. Iron Soldering

150

Gradual

Cooling

Preheating

d) 1.0mm tip diameter (max)

f) Limit soldering time to 3 secs.

280

Soldering

Natural

cooling

Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused

by the difference in coefficients of expansion between solder, chip and substrate. Our terminations are suitable for all

wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot

SDL1108-R47MF

Part No.

SDL1108-R60MF

SDL1108-1R0MF

SDL1108-1R2MF

SDL1108-1R5MF

SDL1108-2R0MF

Recommended temperature profiles for re-flow soldering in Figure 1.

9-2. Soldering

air soldering tools.

9-2.1 Solder Re-flow :

H

6.6±0.5

6.2±0.5

6.2±0.5

6.4±0.5

6.5±0.5

7.2±0.5

+0.2

+0.2

1.4

1.2

-0

-0

6.7±0.5

6.7±0.5

6.2±0.5

5.6±0.5

6.6±0.5

mm

G

5.6±0.5

H

mm

+0.2

+0.2

+0.2

1.8

-0

1.5

-0

-0

mm

1.8

I

-0