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AND4OA 数据表(PDF) 1 Page - Purdy Electronics Corporation |
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AND4OA 数据表(HTML) 1 Page - Purdy Electronics Corporation |
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1 / 2 page ![]() Purdy Electronics Corporation • 720 Palomar Avenue • Sunnyvale, CA 94085 Tel: 408.523.8200 • Fax: 408.733.1287 • sales@purdyelectronics.com • www.purdyelectronics.com 6/12/07 AND4OA Ultra Bright LED Lamps: Type 2 Weight: 2.0 mg Unit: mm 1.25 R0.2 Cathode Index Polarity 1.1 0.6 AND4OA InGaAlP Ultra Bright Orange Light Emission Surface Mount Package Features • Small package size • 2.0 (l) x 1.25 (w) x 1.1 (h) size • Suitable for DIP and REFLOW soldering • Recommended Forward Current: 10 mA Maximum Ratings (Ta = 25°C) Characteristics Symbol Rating Unit Forward Current IF 25 mA Reverse Voltage VR 4V Power Dissipation PD 62.5 mW Operating Temperature Range TOpr -30 to 85 °C Storage Temperature Range TStg -30 to 85 °C Precaution Please be careful of the following: 1. Manual soldering: maximum temperature of iron tip: 260°C max. Soldering time: within 5 sec. per solder-land Soldering portion of lead: up to 1.6 mm from the body of the device 2. Reflow solder: recommended condition is as follows: Electro-Optical Characteristics (Ta = 25°C) Characteristics Symbol Test Condition Minimum Typical Maximum Unit Forward Voltage VF IF = 20 mA –2.0 2.8 V Reverse Current IR VR = 4 V – – 100 µA Luminous Intensity IV IF = 20 mA 27 60 – mcd Peak Emission Wavelength lP IF = 20 mA – 612 – nm Spectral Line Half Width ∆λ IF = 20 mA –15– nm Dominant Wavelength λd IF = 20 mA – 605 – nm Full Viewing Angle θ IV = 1/2 Peak – 140 – degree more than 2 min. 230 °C max. 140 - 160 °C 10 sec. max. Time 4 °C/sec. max. 1.25 1.1 1.25 Reflow 1.25 1.1 1.25 Dip The following soldering patterns are recommended for reflow and dip soldering Product specifications contained herein may be changed without prior notice. It is therefore advisable to contact Purdy Electronics before proceeding with the design of equipment incorporating this product. • RoHS Compliant |
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