THS6032

LOW-POWER ADSL CENTRAL-OFFICE LINE DRIVER

SLOS233C – APRIL1999 – REVISED MARCH 2000

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POST OFFICE BOX 655303

Central Office

– 1.35-W Total Power Dissipation for

Full-Rate ADSL Into a 25-

Ω Load

– Allows Reception of Incoming Signal

During Standby

– Class-G Mode: 4 Power Supplies, 1.35 W

Power Dissipation

– Class-AB Mode: 2 Power Supplies, 2 W

Power Dissipation

– THD = –62 dBc at f = 1 MHz,

– THD = –69 dBc at f = 1 MHz,

25-

Ω Load

– 65-MHz Bandwidth (– 3dB) , 25-

Ω Load

– 100-MHz Bandwidth (– 3dB) , 100-

Ω Load

– 1200 V/

µs Slew Rate

Protection

description

The THS6032 is a low-power line driver ideal for asymmetrical digital subscriber line (ADSL) applications. This

device contains two high-current, high-speed current-feedback drivers, which can be configured differentially

for driving ADSL signals at the central office. The THS6032 features a unique class-G architecture to lower

power consumption to 1.35 W. The THS6032 can also be operated in a traditional class-AB mode to reduce

the number of power supplies to two.

HIGH-SPEED xDSL LINE DRIVER/RECEIVER FAMILY

DEVICE

DRIVER

RECEIVER

5 V

±5 V ±15 V DESCRIPTION

THS6002

•

•

•

•

500-mA differential line driver and receiver

THS6012

•

•

•

500-mA differential line driver

THS6022

•

•

•

250-mA differential line driver

THS6032

•

•

•

500-mA low-power ADSL central-office line driver

THS6062

•

•

•

•

Low-noise ADSL receiver

THS6072

•

•

•

Low-power ADSL receiver

THS7002

•

•

•

Low-noise programmable-gain ADSL receiver

CAUTION: The THS6032 provides ESD protection circuitry. However, permanent damage can still occur if this device is subjected

to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss

of functionality.

Copyright

© 2000, Texas Instruments Incorporated

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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1OUT

1IN–

1IN+

NC

SHDN1

SHDN2

2OUT

2IN–

2IN+

NC

NC

DGND

THERMALLY ENHANCED SOIC (DWP)

PowerPAD

™ PACKAGE

(TOP VIEW)

NC – Not Connected

† This terminal is internally connected to the thermal pad.

Cross section view showing PowerPAD

(SIDE VIEW)

MicroStar Junior

™ (GQE) PACKAGE

(TOP VIEW)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.