PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

TLC548CD

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC548CDR

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC548CP

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLC548ID

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC548IDR

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC548IP

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLC549CD

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC549CDR

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC549CP

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLC549ID

ACTIVE

SOIC

D

8

75

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC549IDR

ACTIVE

SOIC

D

8

2500

Pb-Free

(RoHS)

CU NIPDAU

Level-2-260C-1YEAR/

Level-1-220C-UNLIM

TLC549IP

ACTIVE

PDIP

P

8

50

Pb-Free

(RoHS)

CU NIPDAU

Level-NC-NC-NC

TLC549IPS

ACTIVE

SO

PS

8

80

None

CU NIPDAU

Level-1-220C-UNLIM

TLC549IPSR

ACTIVE

SO

PS

8

2000

None

CU NIPDAU

Level-1-220C-UNLIM

TLC549MP

OBSOLETE

PDIP

P

8

None

Call TI

Call TI

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

product content details.

None: Not yet available Lead (Pb-Free).

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,

including bromine (Br) or antimony (Sb) above 0.1% of total product weight.

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

PACKAGE OPTION ADDENDUM

www.ti.com

22-Feb-2005

Addendum-Page 1