TLE2027, TLE2037, TLE2027A, TLE2037A, TLE2027Y, TLE2037Y

EXCALIBUR LOW-NOISE HIGH-SPEED

PRECISION OPERATIONAL AMPLIFIERS

SLOS192 – FEBRUARY 1997

3

POST OFFICE BOX 655303

TLE202xY chip information

This chip, when properly assembled, displays characteristics similar to the TLE202xC. Thermal compression

or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chip may be mounted with

conductive epoxy or a gold-silicon preform.

BONDING PAD ASSIGNMENTS

CHIP THICKNESS: 15 MILS TYPICAL

BONDING PADS: 4

× 4 MILS MINIMUM

TJmax = 150°C

TOLERANCES ARE

±10%.

ALL DIMENSIONS ARE IN MILS.

PIN (4) IS INTERNALLY CONNECTED

TO BACKSIDE OF CHIP.

(1)

(2)

(3)

(4)

(5)

(6)

(7)

(8)

90

73

(1)

(2)

(3)

(4)

(6)

(7)

(8)

+

–

OUT

IN +

IN –

VCC+

VCC –

OFFSET N1

OFFSET N2

(1)

(3)

(2)

(8)

(7)

(4)

(6)