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TPS2012APWP 数据表(PDF) 18 Page - Texas Instruments |
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TPS2012APWP 数据表(HTML) 18 Page - Texas Instruments |
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18 / 22 page ![]() TPS2010A, TPS2011A, TPS2012A, TPS2013A POWER-DISTRIBUTION SWITCHES SLVS189A – DECEMBER 1998 – REVISED NOVEMBER 1999 18 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 APPLICATION INFORMATION overcurrent (continued) Three possible overload conditions can occur. In the first condition, the output has been shorted before the device is enabled or before VI(IN) has been applied (see Figure 6). The TPS201xA senses the short and immediately switches into a constant-current output. In the second condition, the excessive load occurs while the device is enabled. At the instant the excessive load occurs, very high currents may flow for a short time before the current-limit circuit can react (see Figures 12–19). After the current-limit circuit has tripped (reached the overcurrent trip threshhold) the device switches into constant-current mode. In the third condition, the load has been gradually increased beyond the recommended operating current. The current is permitted to rise until the current-limit threshold is reached or until the thermal limit of the device is exceeded (see Figures 7–10). The TPS201xA is capable of delivering current up to the current-limit threshold without damaging the device. Once the threshold has been reached, the device switches into its constant-current mode. power dissipation and junction temperature The low on-resistance on the n-channel MOSFET allows small surface-mount packages, such as SOIC, to pass large currents. The thermal resistances of these packages are high compared to those of power packages; it is good design practice to check power dissipation and junction temperature. The first step is to find rDS(on) at the input voltage and operating temperature. As an initial estimate, use the highest operating ambient temperature of interest and read rDS(on) from Figures 30–33. Next, calculate the power dissipation using: P D + r DS(on) I2 Finally, calculate the junction temperature: T J + P D RqJA ) TA Where: TA = Ambient Temperature °C RθJA = Thermal resistance SOIC = 172°C/W Compare the calculated junction temperature with the initial estimate. If they do not agree within a few degrees, repeat the calculation, using the calculated value as the new estimate. Two or three iterations are generally sufficient to get an acceptable answer. thermal protection Thermal protection prevents damage to the IC when heavy-overload or short-circuit faults are present for extended periods of time. The faults force the TPS201xA into constant current mode, which causes the voltage across the high-side switch to increase; under short-circuit conditions, the voltage across the switch is equal to the input voltage. The increased dissipation causes the junction temperature to rise to high levels. The protection circuit senses the junction temperature of the switch and shuts it off. Hysteresis is built into the thermal sense circuit, and after the device has cooled approximately 20 degrees, the switch turns back on. The switch continues to cycle in this manner until the load fault or input power is removed. |
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