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ACST12 数据表(PDF) 5 Page - STMicroelectronics |
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ACST12 数据表(HTML) 5 Page - STMicroelectronics |
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5 / 12 page ![]() ACST12 Characteristics 5/12 Figure 12. Relative variation of critical rate of decrease of main current vs. junction temperature Figure 13. Relative variation of static dV/dt immunity vs. junction temperature (dI/dt)c[Tj] / (dI/dt)c[Tj=125°C] Tj(°C) 0 1 2 3 4 5 6 7 8 9 10 11 25 50 75 100 125 dV/dt[Tj] / dV/dt[Tj=125°C] Tj(°C) 0 1 2 3 4 5 6 7 8 9 10 11 12 25 50 75 100 125 VD=VR=400 V Figure 14. Relative variation of maximum clamping voltage, VCL vs. junction temperature Figure 15. Variation of thermal resistance junction to ambient vs. copper surface under tab 0.85 0.90 0.95 1.00 1.05 1.10 1.15 -50 -25 0 25 50 75 100 125 V [T /V [T = 25 °C] CL J CL J T (°C) J Minimum values 0 10 20 30 40 50 60 70 80 0 5 10 15 20 R (°C/W) th(j-a) S (cm²) CU D²PAK Epoxy printed circuit board FR4, copper thickness = 35 µm |
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