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STK22C48
Document Number: 001-51000 Rev. **
Page 13 of 14
Package Diagrams
Figure 13. 28-Pin (300 mil) SOIC (51-85026)
Figure 14. 28-Pin (330 mil) SOIC (51-85058)
PIN 1 ID
0.291[7.39]
0.300[7.62]
0.394[10.01]
0.419[10.64]
0.050[1.27]
TYP.
0.092[2.33]
0.105[2.67]
0.004[0.10]
0.0118[0.30]
SEATING PLANE
0.0091[0.23]
0.0125[3.17]
0.015[0.38]
0.050[1.27]
0.013[0.33]
0.019[0.48]
0.026[0.66]
0.032[0.81]
0.697[17.70]
0.713[18.11]
0.004[0.10]
1
14
15
28
*
*
*
PART #
S28.3 STANDARD PKG.
SZ28.3 LEAD FREE PKG.
MIN.
MAX.
NOTE :
1. JEDEC STD REF MO-119
2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH,BUT
MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.010 in (0.254 mm) PER SIDE
3. DIMENSIONS IN INCHES
4. PACKAGE WEIGHT 0.85gms
DOES INCLUDE MOLD MISMATCH AND ARE MEASURED AT THE MOLD PARTING LINE.
51-85026-*D
51-85058-*A
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