LTM8032

14

8032fa

APPLICATIONS INFORMATION

Figure 5. A Well Chosen Input Network Prevents Input Voltage Overshoot and Ensures

Reliable Operation When the LTM8032 is Hot-Plugged to a Live Supply

+

LTM8032

4.7μF

20V/DIV

10A/DIV

20μs/DIV

CLOSING SWITCH

SIMULATES HOT PLUG

(5a)

(5b)

LOW

IMPEDANCE

ENERGIZED

24V SUPPLY

STRAY

INDUCTANCE

DUE TO 6 FEET

(2 METERS) OF

TWISTED PAIR

+

LTM8032

4.7μF

0.1μF

0.7Ω

20V/DIV

10A/DIV

20μs/DIV

DANGER

ABSOLUTE MAXIMUM RATING

(5c)

+

4.7μF

22μF

35V

AI.EI.

8032 F05

20V/DIV

10A/DIV

20μs/DIV

+

LTM8032

FIN

The die temperature of the LTM8032 must be lower than

the maximum rating of 125°C, so care should be taken

in the layout of the circuit to ensure good heat sinking

of the LTM8032. To estimate the junction temperature,

approximate the power dissipation within the LTM8032 by

applying the typical efficiency stated in this data sheet to

the desired output power, or, if you have an actual module,

by taking a power measurement. Then calculate the tem-

perature rise of the LTM8032 junction above the surface

of the printed circuit board by multiplying the module’s

power dissipation by the thermal resistance. The actual

thermal resistance of the LTM8032 to the printed circuit

board depends upon the layout of the circuit board, but

the thermal resistance given in the Pin Configuration,

as well as the internal temperature rise curves given in

the Typical Performance Characteristics section, can be

used a guide. Both the thermal resistance and internal

FR4 PC board.

Finally, be aware that at high ambient temperatures the

internal Schottky diode will have significant leakage current,

increasing the input quiescent current of the LTM8032.