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MQPI-18LP 数据表(PDF) 2 Page - Vicor Corporation

部件名 MQPI-18LP
功能描述  28 Volt Input, 7 Amp MIL COTS EMI Filter for VI Chips
PDF  2 Pages
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制造商  VICOR [Vicor Corporation]
网页  http://www.vicorpower.com
标志 VICOR - Vicor Corporation

MQPI-18LP 数据表(HTML) 2 Page - Vicor Corporation

  MQPI-18LP Datasheet HTML 1Page - Vicor Corporation MQPI-18LP Datasheet HTML 2Page - Vicor Corporation  
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Picor Corporation • www.picorpower.com
MQPI-18 Data Sheet Rev. 1.0
11-08
Page 2 of 2
PRELIMINARY
Absolute Maximum Ratings – Exceeding these parameters may result in permanent damage to the product.
Electrical Characteristics – Parameter limits apply over the operating PCB temperature range unless otherwise noted
Pins
Parameter
Notes
Min
Max
Units
Bus+ to Bus–
Input voltage
Continuous
-80
80
Vdc
Bus+ to Bus–
Input voltage
100 ms transient
-100
100
Vdc
BUS+ / BUS– to shield plane
BUS inputs to shield hipot
-1500
1500
Vdc
QPI+ to QPI–
Input to output current
Continuous @ 25°C
7
Adc
Package
Power dissipation
@ 25°C
1.50
W
Package
Operating temperature
PCB to filter interface
-55
100
°C
Package
Thermal resistance
Free air
75
°C/W
Package
Thermal resistance
PCB
(1)
30
°C/W
Package
Storage temperature
-65
125
°C
Package
Peak reflow temperature
20 s exposure
225
°C
All Pins
ESD
HBM
-2
+2
kV
Parameter
Notes
Min
Typ
Max
Units
Bus+ to Bus- input range
Measured at 7 A
80
Vdc
Bus+ to Out+ voltage drop
Measured at 7 A
(2)
110
mVdc
Bus- to Out- voltage drop
Measured at 7 A
(2)
110
mVdc
Common mode attenuation
VBUS = 28 V Frequency = 1.0 MHz@25ºC
45
dB
Differential mode attenuation
VBUS = 28 V Frequency = 1.0 MHz@25ºC
75
dB
Input bias current at 80 V
Input current from Bus+ to Bus-
10
µA
0.1100"[2.794mm]
0.0900"[2.286mm]
Pad Detail: 10 Places
(Dimensions indicate finished
soldermask pad openings)
1
2
3
4
5
6
8
7
9
10
0.400" [10.16mm]
0.232" [5.89mm]
0.232" [5.89mm]
0.200" [5.08mm]
0.200" [5.08mm]
0.200" [5.08mm]
0.057" [1.45mm]
0.057" [1.45mm]
0.096" [2.44mm]
0.200" [5.08mm]
0.132" [3.35mm]
0.060" [1.52mm]
0.996"[25.28mm]
NOTES:
1. Demensions are all in inches [MM].
2. Top & Bottom Package Planarity:0.15 [0.006]
0.15
[0.006]
Pin 1
0.508"[12.90mm]
0.196"[4.98mm]
0.190"[4.826mm]
Top View
Bottom View
Pad Description
Package Outline Drawing (lidded version)
Pin
Number
Name
Description
8, 9
Bus +
Positive bus potential
1, 10
Bus –
Negative bus potential
6, 7
Out +
Positive input to the converter
4, 5
Out –
Negative input to the converter
2, 3
Shield
Shield connects to system chassis
or safety ground.
Note 2: Derating curve TBD.
Ordering Information
Part
Number
Description
MQPI-18LP
LGA, Pb solder, lidded package
MQPI-18LP-01
LGA, Pb solder, open-frame package
Note 1: PCB layout guidelines will be available in final version of this data sheet.



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