AD9572

Rev. 0 | Page 9 of 20

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter

Rating

VS to GND

−0.3 V to +3.6 V

REFCLK to GND

−0.3 V to VS + 0.3 V

BYPASSx to GND

−0.3 V to VS + 0.3 V

XO to GND

−0.3 V to VS + 0.3 V

FREQSEL, FORCE_LOW, and

REFSEL to GND

−0.3 V to VS + 0.3 V

25M, 33M, 100M/125M, 106M, and

156M to GND

−0.3 V to VS + 0.3 V

Junction Temperature1

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

soldered in a circuit board for surface-mount packages.

Thermal impedance measurements were taken on a 4-layer

board in still air in accordance with EIA/JESD51-7.

Table 12. Thermal Resistance

Package Type

Unit

40-Lead LFCSP

27.5

°C/W

ESD CAUTION