ADL5562ACPZ-R7 datasheet(21/24 Pages) AD

21 / 24 page

ADL5562

Rev. A | Page 21 of 24

COMPLIANT

TO JEDEC STANDARDS MO-220-VHHC

OUTLINE DIMENSIONS

0.65

BSC

PIN 1

INDICATOR

2.60 BSC

0.75

0.60

0.50

TOP VIEW

12° MAX

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.05

0.90

0.85

0.80

0.35

0.28

0.23

0.05 MAX

0.01 NOM

0.20 REF

0.70

0.65

0.60

3.20

3.10 SQ

3.00

EXPOSED

PAD

(BOTTOM VIEW)

0.60 MAX

5.00

BSC SQ

4.75

BSC SQ

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 46. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

3 mm × 3 mm Body, Very Thin Quad

(CP-16-2)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature

Range

Package Description

Package

Option

Branding

Ordering

Quantity

ADL5562ACPZ-R71

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ], 7”Reel

CP-16-2

Q1Q

1,500

ADL5562ACPZ-WP1

−40°C to +85°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ], Waffle Pack

CP-16-2

Q1Q

ADL5562-EVALZ1

Evaluation Board

1 Z = RoHS Compliant Part.

ADL5562ACPZ-R7 数据表(PDF) 21 Page - Analog Devices

ADL5562ACPZ-R7 数据表(HTML) 21 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24

数据表下载