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MCP6231-E/MS 数据表(PDF) 35 Page - Microchip Technology |
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MCP6231-E/MS 数据表(HTML) 35 Page - Microchip Technology |
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35 / 40 page ![]() © 2009 Microchip Technology Inc. DS21881E-page 35 MCP6231/2/4 APPENDIX A: REVISION HISTORY Revision E (August 2009) The following is the list of modifications: 1. Added the 2x3 TDFN package for MCP6232. 2. Updated the 2x3 DFN package information for MCP6231. 3. Updated the “Temperature Characteristics” table. 4. Updated Section 3.0 “Pin Descriptions”. 5. Updated the Package Outline Drawings in Section 6.0 “Packaging Information”. 6. Updated the Product Identification Systems section. Revision D (May 2008) The following is the list of modifications: 1. Changed Heading “Available Tools” to “Design Aids”. 2. Design Aids: Name change for Mindi Simulator Tool. 3. Package Types: Added DFN to MCP6231 Device. 4. Absolute Maximum Ratings: Numerous changes in this section. 5. Updated notes to Section 1.0 “Electrical Characteristics”. 6. Added Test Circuits to Section 1.0 “Electrical Characteristics”. 7. Corrected Figure 2-7. 8. Added Figure 2-19. 9. Numerous changes to Section 3.0 “Pin Descriptions”. 10. Added Section 4.1.1 “Phase Reversal”, Section 4.1.2 “Input Voltage and Current Limits”, and Section 4.1.3 “Normal Operation”. 11. Replaced Section 5.0 “Design Aids” with additional information. 12. Updated Section 6.0 “Packaging Information” with updated Package Outline Drawings. Revision C (March 2005) The following is the list of modifications: 1. Added the MCP6234 quad op amp. 2. Corrected plots in Section 2.0 “Typical Performance Curves”. 3. Added Section 3.0 “Pin Descriptions”. 4. Added new SC-70 package markings. Added PDIP-14, SOIC-14, and TSSOP-14 packages and corrected package marking information ( Section 6.0 “Packaging Information”). 5. Added Appendix A: “Revision History”. Revision B (August 2004) • Undocumented changes. Revision A (March 2004) • Original Release of this Document. |
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