TC1313 datasheet(7/32 Pages) MICROCHIP

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DS21974B-page 7

TC1313

TEMPERATURE SPECIFICATIONS

Output Short Circuit Current

(Average)

IOUTsc2

—

240

—

RLOAD2 ≤ 1Ω

Wake-Up Time

(From SHDN2 mode), (VOUT2)

tWK

—31

100

µs

IOUT1 = IOUT2 = 50 mA

Settling Time

(From SHDN2 mode), (VOUT2)

—

100

—

µs

IOUT1 = IOUT2 = 50 mA

Electrical Specifications:

Unless otherwise indicated, all limits are specified for: VIN = +2.7V to +5.5V

Parameters

Sym

Min

Typ

Max

Units

Conditions

Temperature Ranges

Operating Junction Temperature Range

-40

—

+125

°C

Steady state

Storage Temperature Range

-65

—

+150

°C

Maximum Junction Temperature

—

+150

°C

Transient

Thermal Package Resistances

Thermal Resistance, 10L-DFN

θJA

—

°C/W

Typical 4-layer board with Internal

Ground Plane and 2 Vias in Thermal

Pad

Thermal Resistance, 10L-MSOP

θJA

—

113

—

°C/W

Typical 4-layer board with Internal

Ground Plane

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics:

VIN1 = VIN2 = SHDN1,2 = 3.6V, COUT1 =CIN = 4.7 µF, COUT2 =1µF, L = 4.7 µH, VOUT1 (ADJ) = 1.8V,

IOUT1 = 100 ma, IOUT2 = 0.1 mA TA = +25°C. Boldface specifications apply over the TA range of -40°C to +85°C.

Parameters

Sym

Min

Typ

Max

Units

Conditions

Note

The Minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VRX + VDROPOUT, VRX = VR1 or VR2.

VRX is the regulator output voltage setting.

TCVOUT2 = ((VOUT2max – VOUT2min) * 106)/(VOUT2 * DT).

Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested

over a load range from 0.1 mA to the maximum specified output current.

Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its

nominal value measured at a 1V differential.

The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air. (i.e. TA, TJ, θJA). Exceeding the maximum allowable power

dissipation causes the device to initiate thermal shutdown.

The integrated MOSFET switches have an integral diode from the LX pin to VIN, and from LX to PGND. In cases where

these diodes are forward-biased, the package power dissipation limits must be adhered to. Thermal protection is not

able to limit the junction temperature for these cases.

VIN1 and VIN2 are supplied by the same input source.

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