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MCP6V02 数据表(PDF) 39 Page - Microchip Technology |
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MCP6V02 数据表(HTML) 39 Page - Microchip Technology |
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39 / 44 page ![]() © 2008 Microchip Technology Inc. DS22058C-page 41 MCP6V01/2/3 APPENDIX A: REVISION HISTORY Revision C (December 2008) The following is the list of modifications: 1. Added the 8-lead, 2x3 TDFN package for the MCP6V01 and MCP6V03 devices. 2. Corrected the IMD specification in Table 1-2. 3. Added 8-lead, 2x3 TDFN package information to Thermal Characteristic table. 4. Added information on the Exposed Thermal Pad (EP) for the 8-lead, 2x3 TDFN and 8-lead, 4x4 DFN packages. 5. Added Section 4.3.6 “Stabilizing Output Loads” 6. Other minor typographical corrections. Revision B (June 2008) The following is the list of modifications: 1. Updated the specifications and their conditions. 2. Corrected the Timing Diagrams. 3. Added to the Test Circuits. 4. Added RISO (see Figure 4-6) to all circuit diagrams. 5. Added the Typical Performance Curves. 6. Corrected and expanded Applications Information. 7. Minor edits due to change in production status. 8. Added Appendix B, Offset Related Test Screens. Revision A (September 2007) • Original Release of this Document. |
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