MPXA6115A

Sensors

Freescale Semiconductor

7

Pressure

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must be

the correct size to ensure proper solder connection interface

between the board and the package. With the correct pad

geometry, the packages will self-align when subjected to a

solder reflow process. It is always recommended to fabricate

boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

Figure 5. SOP Footprint (Case 482)

Figure 6. SSOP Footprint (Case 1317 and 1317A)

0.660

16.76

0.060 TYP 8X

1.52

0.100 TYP

2.54

0.300

7.62

inch

mm

0.100 TYP 8X

2.54

0.027 TYP 8X

0.69

0.053 TYP 8X

1.35

inch

mm

0.387

9.83

0.150

3.81

0.050

1.27

TYP