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MPXV5010G 数据表(PDF) 9 Page - Freescale Semiconductor, Inc

部件名 MPXV5010G
功能描述  Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated
PDF  23 Pages
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制造商  FREESCALE [Freescale Semiconductor, Inc]
网页  http://www.freescale.com
标志 FREESCALE - Freescale Semiconductor, Inc

MPXV5010G 数据表(HTML) 9 Page - Freescale Semiconductor, Inc

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MPX5010
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
CASE 482B-03
ISSUE B
SMALL OUTLINE PACKAGE
CASE 482C-03
ISSUE B
SMALL OUTLINE PACKAGE
MILLIMETERS
INCHES
0.100 BSC
2.54 BSC
DIM
A
B
C
D
G
J
K
M
N
S
MIN
0.415
0.415
0.210
0.026
0.009
0.100
0˚
0.405
0.540
MAX
0.425
0.425
0.220
0.034
0.011
0.120
15˚
0.415
0.560
MIN
10.54
10.54
5.33
0.66
0.23
2.54
0˚
10.29
13.72
MAX
10.79
10.79
5.59
0.864
0.28
3.05
15˚
10.54
14.22
PIN 1 IDENTIFIER
K
SEATING
PLANE
-T-
DETAIL X
S
G
4
5
8
1
-A-
-B-
C
M
J
N
D 8 PL
S
B
M
0.25 (0.010)
A S
T
DETAIL X
NOTES:
1.
2.
3.
4.
5.
6.
DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
CONTROLLING DIMENSION: INCH.
DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
MAXIMUM MOLD PROTRUSION 0.15 (0.006).
ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
10.54
0.425
0.415
10.79
B
10.54
0.425
0.415
10.79
C
12.70
0.520
0.500
13.21
D
0.66
0.034
0.026
0.864
G
0.100 BSC
2.54 BSC
J
0.009
0.011
0.23
0.28
K
0.100
0.120
2.54
3.05
M
0
15
0
15
N
0.444
0.448
11.28
11.38
S
0.540
0.560
13.72
14.22
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5
_ TYPICAL DRAFT.
6. DIMENSION S TO CENTER OF LEAD WHEN
FORMED PARALLEL.
__
_
_
PIN 1
K
SEATING
PLANE
–T–
S
G
4
5
8
1
–A–
–B–
C
N
V
W
M
J
V
0.245
0.255
6.22
6.48
W
0.115
0.125
2.92
3.17
IDENTIFIER
D 8 PL
S
B
M
0.25 (0.010)
A S
T
DETAIL X
DETAIL X



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