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MPC8533VTALJB 数据表(PDF) 78 Page - Freescale Semiconductor, Inc |
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MPC8533VTALJB 数据表(HTML) 78 Page - Freescale Semiconductor, Inc |
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78 / 116 page ![]() MPC8533E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 3 78 Freescale Semiconductor Package Description 18 Package Description This section details package parameters, pin assignments, and dimensions. 18.1 Package Parameters for the MPC8533E FC-PBGA The package parameters for flip chip plastic ball grid array (FC-PBGA) are provided in Table 56. Table 56. Package Parameters Parameter PBGA1 Package outline 29 mm × 29 mm Interconnects 783 Ball pitch 1 mm Ball diameter (typical) 0.6 mm Solder ball (Pb-free) 96.5% Sn 3.5% Ag Note: 1. (FC-PBGA) without a lid. |
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