●

Low profile space

●

Ideal for automated placement

●

Glass passivated chip junction

●

Low forward voltage drop

●

Low leakage current

●

High forward surge capability

●

High temperature soldering：

260℃/10 seconds at terminals

●

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

●

Case: MBF Molded plastic

over glass passivated chip

●

Terminals: Solder plated, solderable per

J-STD-002B and JESD22-B102D

●

Polarity: Polarity symbols marked on body

Symbol MB05F MB1F MB2F MB4F MB6F MB8F MB10F UNIT

50

100

200

400

600

800 1000

V

35

70

140

280

420

560

700

V

50

100

200

400

600

800 1000

V

Maximum average forward output rectified

A

V

μA

p F

(NOTE 1)

(NOTE 2)

(NOTE 1)

℃

NOTE1

:On glass epoxy P.C.B. mounted on 0.05

×0.05″(1.3×1.3mm) pads

NOTE2

:On aluminum substrate P.C.B. with an area of 0.8″×0.8″(20

×20mm) mounted

on 0.05

×0.05″(1.3×1.3mm) solder pad

13

℃/ W

A

0.5

0.8

35

1

5.0

100

85

70

20

–55 to +150

Maximum DC blocking voltage

Operating junction and storage temperature range

Typical junction capacitance per leg at 4.0 V ,1MHz

Maximum instantaneous forwad voltage drop

per leg at 0.4A

Thermal resistance per leg

Peak forward surge current 8.3 ms single half sine-wave

superimposed on rated load(JEDEC Method)

Maximum DC reverse current at

rated DC blocking voltage per leg

Maximum RMS voltage

Maximum repetitive peak reverse voltage

thru

MB05F

MB10F

Miniature Glass Passivated Single-Phase Surface Mount Flat Bridge Rectifier

FEATURES

VOLTAGE - 50 TO 1000 VOLTS

CURRENT - 0.5 AMPERES

MECHANICAL DATA

MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS

Major Ratings and Characteristics

0.5A , 0.8A

0.5A , 0.8A

35 A

5.0

μA

50-1000V

1.0V

150

°C

1

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