●

Low profile space

●

Ideal for automated placement

●

Glass passivated chip junction

●

Low forward voltage drop

●

Low leakage current

●

High forward surge capability

●

High temperature soldering：

260℃/10 seconds at terminals

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Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

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Case: MBF Molded plastic

over glass passivated chip

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Terminals: Solder plated, solderable per

J-STD-002B and JESD22-B102D

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Polarity: Polarity symbols marked on body

thru

MB105 F

MB110F

Miniature Glass Passivated Single-Phase Surface Mount Flat Bridge Rectifier

FEATURES

VOLTAGE - 50 TO 1000 VOLTS

CURRENT - 1.0 AMPERES

MECHANICAL DATA

MAXIMUM RATIXGS AND ELECTRICAL CHARACTERISTICS

Major Ratings and Characteristics

35 A

5.0

μA

50-1000V

1.0V

150

°C

1

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1.0A

1.0A

Symbol MB105F MB11F MB12F MB14F MB16F MB18F MB110F UNIT

50

100

200

400

600

800

1000

V

35

70

140

280

420

560

700

V

50

100

200

400

600

800

1000

V

A

A

V

μA

p F

℃

NOTE1: Units mounted on P.C.B. with 0.05

×0.05″(1.3×1.3mm) pads

Maximum repetitive peak reverse voltage

35

Maximum instantaneous forwad voltage drop

per leg at 1.0A

1.1

Maximum RMS voltage

Maximum DC blocking voltage

Operating junction and storage temperature range

–55 to +150

Thermal resistance per leg (NOTE 1)

Maximum average forward output rectified current

1.0

70

20

℃/ W

Maximum DC reverse current at

rated DC blocking voltage per leg

5.0

100

Typical junction capacitance per leg at 4.0 V ,1MHz

13

Peak forward surge current 8.3 ms single half sine-

wave superimposed on rated load(JEDEC Method)