10/2009

AWU6604

3.4 V / 28.25 dBm Linear PA Module

Data Sheet - Rev 2.0

M45 Package

10 Pin 3 mm x 3 mm x 1 mm

Surface Mount Module

Figure 1: Block Diagram

FEATURES

• HSPA Compliant

• InGaP HBT Technology

• Low Quiescent Current with only 2 Bias Modes

• Simpler Calibration

• HighEfficiency:(R99waveform)

• LowQuiescentCurrent:9.0mA

• LowLeakageCurrentinShutdownMode:<1µA

• InternalVoltageRegulator

• Integrated “daisy chainable” directional couplers

• Optimizedfora50Ω System

• LowProfileMiniatureSurfaceMountPackage

APPLICATIONS

• WCDMA/HSPAAWS/UMTS1700-BandWireless

HandsetsandDataDevices

PRODUCT DESCRIPTION

WCDMA product for UMTS handsets. This PA

provide low power consumption without the need

foranexternalvoltageregulator.A“daisychainable”

directional coupler is integrated in the module thus

eliminating the need of external couplers. The

deviceismanufacturedonanadvancedInGaPHBT

MMIC technology offering state-of-the-art reliability,

temperaturestability,andruggedness.Therearetwo

selectable bias modes that optimize efficiency for

differentoutputpowerlevels,andashutdownmode

withlowleakagecurrent,whichincreaseshandsettalk

and standby time. The self-contained 3 mm x 3 mm x

1 mm surface mount package incorporates matching

networksoptimizedforoutputpower,efficiency,and

linearityina50Ω system.

AWU6604

1

2

3

4

5

10

9

8

7

6

GND

Bias Control

VoltageRegulation

CPL

GNDatSlug(pad)