DICE/DWF SPECIFICATION

2

LT1007

1007dice/dwffa

Linear Technology Corporation

1630 McCarthy Blvd., Milpitas, CA 95035-7417

© LINEAR TECHNOLOGY CORPORATION 2009

I.D.No. 66-13-1007 • LT 1009 REV A • PRINTED IN USA

Wafer level testing is performed per the indicated specifications for dice. Considerable differences in performance can often be observed for dice versus

packaged units due to the influences of packaging and assembly on certain devices and/or parameters. Please consult factory for more information

on dice performance and lot qualifications via lot sampling test procedures.

Dice data sheet subject to change. Please consult factory for current revision in production.