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ISO7421 数据表(PDF) 11 Page - Texas Instruments |
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ISO7421 数据表(HTML) 11 Page - Texas Instruments |
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11 / 18 page ![]() TC − Case Temperature − °C 0 20 40 60 80 100 120 140 160 180 200 0 50 100 150 200 VCC1, VCC2 at 3.6 V G002 VCC1, VCC2 at 5.5 V S0417-01 1 2 3 4 8 7 6 5 V CC1 0.1 F m 2 mm max. from V CC1 OUTA INB OUTPUT INPUT GND1 ISO7421 V CC2 0.1 F m 2 mm max. from V CC2 INA OUTB OUTPUT INPUT GND2 OUT 8 W 13 W IN 1MW 500 W Input Output VCC1 VCC1 VCC1 VCC2 S0422-01 ISO7421, ISO7421M www.ti.com....................................................................................................................................................................................................... SLLS984 – JUNE 2009 (over recommended operating conditions unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT θ JC Junction-to-case thermal resistance 69.1 °C/W VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF, PD Device power dissipation 390 mW Input a 150-Mbps 50% duty-cycle square wave Figure 5. θ JC Thermal Derating Curve per IEC 60747-5-2 Figure 6. Typical ISO7421 Application Circuit Figure 7. Device I/O Schematics Copyright © 2009, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): ISO7421 ISO7421M |
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