CPC1560

R00F

PRELIMINARY

13

6. Manufacturing Information

6.1 Soldering

For proper assembly, the component must be

processed in accordance with the current revision of

IPC/JEDEC standard J-STD-020. Failure to follow the

recommended guidelines may cause permanent

damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

6.2 Washing

Clare does not recommend ultrasonic cleaning or the

use of chlorinated hydrocarbons.

6.3 Mechanical Dimensions

RoHS

2002/95/EC

Pb

2.540 ± 0.127

(0.100 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

9.144 ± 0.508

(0.360 ± 0.020)

0.457 ± 0.076

(0.018 ± 0.003)

9.652 ± 0.381

(0.380 ± 0.015)

8-Pin DIP Through-Hole Package

7.239 TYP.

(0.285)

7.620 ± 0.254

(0.300 ± 0.010)

4.064 TYP

(0.160)

0.889 ± 0.102

(0.035 ± 0.004)

PC Board Pattern

Dimensions

mm

(inches)

8-0.800 DIA.

(8-0.031 DIA.)

2.540 ± 0.127

(0.100 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

6.350 ± 0.127

(0.250 ± 0.005)

3.302 ± 0.051

(0.130 ± 0.002)

0.254 TYP

(0.01)

8-Pin Surface Mount Package

2.540 ± 0.127

(0.100 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

6.350 ± 0.127

(0.250 ± 0.005)

9.525 ± 0.254

(0.375 ± 0.010)

0.457 ± 0.076

(0.018 ± 0.003)

Recommended PCB Land Pattern

Dimensions

mm

(inches)

0.813 ± 0.120

(0.032 ± 0.004)

4.445 ± 0.127

(0.175 ± 0.005)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.127

(0.025 ± 0.005)

0.254 ± 0.127

(0.010 ± 0.0005)

2.54

(0.10)

8.90

(0.3503)

1.65

(0.0649)

0.65

(0.0255)

3.302 ± 0.051

(0.130 ± 0.002)