www.clare.com

4

CPC1963

R04

MECHANICAL DIMENSIONS

Manufacturing Information

RoHS

2002/95/EC

Pb

Soldering

For proper assembly, the component must be

processed in accordance with the current revision

of IPC/JEDEC standard J-STD-020. Failure to

follow the recommended guidelines may cause

permanent damage to the device resulting in impaired

performance and/or a reduced lifetime expectancy.

Washing

Clare does not recommend ultrasonic cleaning or the

use of chlorinated solvents.

6-Pin Surface Mount Package

Recommended PCB Land Pattern

Dimensions

mm

(inches)

4.445 ± 0.127

(0.175 ± 0.005)

2.159 ± 0.102

(0.085 ± 0.004)

3.302 ± 0.051

(0.130 ± 0.002)

7.620 ± 0.254

(0.300 ± 0.010)

0.635 ± 0.127

(0.025 ± 0.005)

0.254 ± 0.0127

(0.010 ± 0.0005)

2.540 ± 0.127

(0.100 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

6.350 ± 0.127

(0.250 ± 0.005)

0.457 ± 0.076

(0.018 ± 0.003)

9.525 ± 0.254

(0.375 ± 0.010)

2.54

(0.10)

8.90

(0.350)

1.65

(0.065)

0.65

(0.0256)

Dimensions

mm

(inches)

6-Pin DIP Package

PC Board Pattern (Top View)

4.064 TYP.

(0.160 TYP.)

2.159 ± 0.102

(0.085 ± 0.004)

3.302 ± 0.051

(0.130 ± 0.002)

7.239 TYP.

(0.285 TYP.)

7.620 ± 0.254

(0.300 ± 0.010)

9.144 ± 0.508

(0.360 ± 0.020)

0.254 TYP.

(0.010 TYP.)

5.080 ± 0.127

(0.200 ± 0.005)

7.620 ± 0.127

(0.300 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

6 - 0.800 DIA.

(6 - 0.031 DIA.)

6.350 ± 0.127

(0.250 ± 0.005)

2.540 ± 0.127

(0.100 ± 0.005)

9.652 ± 0.381

(0.380 ± 0.015)

6.350 ± 0.127

(0.250 ± 0.005)

0.457 ± 0.076

(0.018 ± 0.003)