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数据搜索系统，热门电子元器件搜索 |
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CPC7583MATR 数据表(PDF) 19 Page - Clare, Inc. |
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CPC7583MATR 数据表(HTML) 19 Page - Clare, Inc. |
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19 / 21 page  CPC7583 R06 www.clare.com 19 3.1.3 CPC7583M NOTE: Because the metallic pad on the bottom of the DFN package is connected to the substrate of the die, Clare recommends that no printed circuit board traces cross this area to avoid potential shorting issues. 28-Lead DFN Package Recommended PCB Land Pattern Dimensions mm (inches) 7.0 (0.276) 11.0 (0.433) 7.5±0.05 (0.296±0.002) 5.0±0.05 (0.197±0.002) 0.75 (0.030) 0.33 +0.07,-0.05 (0.013 +0.003, -0.002) 0.55±0.10 (0.022±0.004) Bottom side metallic pad Pin 1 0.90±0.10 (0.036 ±0.004) 0.02 +0.03, -0.02 (0.001 +0.0012, -0.001) Seating Plane 0.20 (0.008) Pin 1 6.70 (0.264) 0.75 (0.03) 0.35 (0.016) 1.05 (0.045) |
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