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SC656 数据表(PDF) 14 Page - Semtech Corporation |
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SC656 数据表(HTML) 14 Page - Semtech Corporation |
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14 / 17 page ![]() SC656 4 Applications Information (continued) Output Open Circuit Protection Over-Voltage Protection (OVP) at the OUT pin prevents the charge pump from producing an excessively high output voltage. In the event of an open circuit between the OUT pin and all current sinks (no loads connected), the charge pump runs in open loop and the voltage rises up to the OVP limit. OVP operation is hysteretic, meaning the charge pump will momentarily turn off until V OUT is sufficiently reduced. The maximum OVP threshold is 6.0V, allowing the use of a ceramic output capacitor rated at 6.3V. Over-Temperature Protection The Over-Temperature (OT) protection circuit prevents the device from overheating and experiencing a catastrophic failure. When the junction temperature exceeds 65°C, the device goes into thermal shutdown with all outputs dis- abled until the junction temperature is reduced. All regis- ter information is retained during thermal shutdown. Hysteresis of 20°C is provided to ensure that the device cools sufficiently before re-enabling. Charge Pump Output Current Limit The device limits the charge pump current at the OUT pin. If the OUT pin is shorted to ground, or V OUT is lower than 2.5V, the typical output current limit is 70mA. The output current is limited to 225mA when over loaded resistively with V OUT greater than 2.5. LED Float Detection Float detect is a fault detection feature of the LED back- light outputs. If an output is programmed to be enabled and an open circuit fault occurs at any backlight output, that output will be disabled to prevent a sustained output OVP condition from occurring due to the resulting open loop. Float detect ensures device protection but does not ensure optimum performance. PCB Layout Considerations The layout diagram in Figure 2 illustrates a proper two layer PCB layout for the SC656 and supporting compo- nents. Following fundamental layout rules is critical for achieving the performance specified in the Electrical Characteristics table. The following guidelines are rec- ommended when developing a PCB layout: Figure 2 — Recommended Layout COUT ISETS BL1 C2- GND BANK2 ENS BL7 IN OUT SC656 ISETM GND RSETS GND IN BANK1 RSETM CIN GND Ground Plane C1 C2 |
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