TS2DDR2811 datasheet(3/13 Pages) TI

3 / 13 page

TS2DDR2811

www.ti.com

SCDS294 – DECEMBER 2009

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VCC

Supply voltage range

–0.5

4.6

VIN

Control input voltage range(2) (3)

–0.5

VI/O

Switch I/O voltage range(2) (3) (4)

–0.5

IIK

Control input clamp current

VIN < 0 or VIN > VCC

–50

II/OK

I/O port clamp current

VI/O < 0 or VI/O > VCC

–50

II/O

ON-state switch current(5)

±128

Continuous current through VDD or GND

±100

θJA

Package thermal impedance(6)

31.8

°C/W

Tstg

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground, unless otherwise specified.

(3)

The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

(4)

VI and VO are used to denote specific conditions for VI/O.

(5)

II and IO are used to denote specific conditions for II/O.

(6)

The package thermal impedance is calculated in accordance with JESD 51-7.

RECOMMENDED OPERATING CONDITIONS

(1)

MIN

MAX

UNIT

VCC

Supply voltage

3.6

VIH

High-level control input voltage

SEL

5.5

VIL

Low-level control input voltage

SEL

0.8

Input voltage

SEL

5.5

VI/O

Input/output voltage

VCC

Operating free-air temperature

–40

°C

(1)

All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application report,

Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

ELECTRICAL CHARACTERISTICS

for 1000 Base-T Ethernet switching over recommended operating free-air temperature range, VCC = 3.3 V ± 0.3 V

(unless otherwise noted)

PARAMETER

TEST CONDITIONS(1)

MIN

TYP(2) MAX

UNIT

VIK

SEL

VCC = 3.6 V,

IIN = –18 mA

–0.7

–1.2

IIH

SEL

VCC = 3.6 V,

VIN = VCC

±1

μA

IIL

SEL

VCC = 3.6 V,

VIN = GND

±1

μA

ICC

VCC = 3.6 V,

II/O = 0,

Switch ON or OFF

250

500

μA

CIN

SEL

f = 1 M Hz,

VIN = 0

2.5

COFF

B port

VI = 0,

f = 1 MHz,

Outputs open,

Switch OFF

2.5

CON

VI = 0,

f = 1 MHz,

Outputs open,

Switch ON

TBD

rON

VCC = 3 V,

1.5 V

≤ VI ≤ VCC,

IO = –40 mA

Ω

rON(flat)

(3)

VCC = 3 V,

VI = 1.5 V and VCC,

IO = –40 mA

0.5

Ω

ΔrON

(4)

VCC = 3 V,

1.5 V

≤ VI ≤ VCC,

IO = –40 mA

0.4

Ω

(1)

VI, VO, II, and IO refer to I/O pins. VIN refers to the control inputs.

(2)

All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.

(3)

rON(flat) is the difference of rON in a given channel at specified voltages.

(4)

ΔrON is the difference of rON from center (A4, A5) ports to any other port.

Submit Documentation Feedback

Product Folder Link(s): TS2DDR2811

TS2DDR2811 数据表(PDF) 3 Page - Texas Instruments

TS2DDR2811 数据表(HTML) 3 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13

数据表下载

链接网址

TS2DDR2811 数据表(PDF) 3 Page - Texas Instruments

TS2DDR2811 数据表(HTML) 3 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13

数据表 下载

链接网址

数据表下载