LEG35162-R1 datasheet(6/6 Pages) LIGITEK

6 / 6 page

This test intended to see soldering well

performed or not.

The purpose of this test is the resistance

of the device under tropical for hous.

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

Solderability Test

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

High Temperature

High Humidity Test

Thermal Shock Test

Solder Resistance

Test

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=105 ℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

1.Ta=65 ℃±5℃

2.RH=90 %~95%

3.t=240hrs ±2hrs

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

MIL-STD-202:103B

JIS C 7021: B-11

PART NO. LEG35162/R1

Page 5/5

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

Operating Life Test

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

High Temperature

Storage Test

Low Temperature

Storage Test

The purpose of this is the resistance of

the device which is laid under ondition

of hogh temperature for hours.

1.Ta=-40 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

1.Ta=105 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Reliability Test:

Test Item

Test Condition

Description

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

JIS C 7021: B-12

MIL-STD-883:1008

JIS C 7021: B-10

Reference

Standard

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

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