LEY35162-R1 datasheet(6/6 Pages) LIGITEK

6 / 6 page

MIL-STD-202:103B

JIS C 7021: B-11

1.Ta=65℃±5℃

2.RH=90 %~95%

3.t=240hrs ±2hrs

High Temperature

High Humidity Test

The purpose of this test is the resistance

of the device under tropical for hous.

Solderability Test

This test intended to see soldering well

performed or not.

1.T.Sol=230 ℃±5℃

2.Dwell time=5 ±1sec

Solder Resistance

Test

Thermal Shock Test

This test intended to determine the

thermal characteristic resistance

of the device to sudden exposures

at extreme changes in temperature

when soldering the lead wire.

1.T.Sol=260 ℃±5℃

2.Dwell time= 10 ±1sec.

The purpose of this is the resistance of

the device to sudden extreme changes

in high and low temperature.

1.Ta=105 ℃±5℃&-40℃±5℃

(10min) (10min)

2.total 10 cycles

MIL-STD-202: 208D

MIL-STD-750: 2026

MIL-STD-883: 2003

JIS C 7021: A-2

MIL-STD-202: 210A

MIL-STD-750: 2031

JIS C 7021: A-1

MIL-STD-202: 107D

MIL-STD-750: 1051

MIL-STD-883: 1011

1.Under Room Temperature

2.If=20mA

3.t=1000 hrs (-24hrs, +72hrs)

This test is conducted for the purpose

of detemining the resisance of a part

in electrical and themal stressed.

Low Temperature

Storage Test

High Temperature

Storage Test

The purpose of this is the resistance

of the device which is laid under

condition of low temperature for hours.

1.Ta=-40 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

The purpose of this is the resistance of

the device which is laid under ondition

of hogh temperature for hours.

1.Ta=105 ℃±5℃

2.t=1000 hrs (-24hrs, +72hrs)

Reliability Test:

Operating Life Test

Test Item

Test Condition

Description

MIL-STD-750: 1026

MIL-STD-883: 1005

JIS C 7021: B-1

JIS C 7021: B-12

MIL-STD-883:1008

JIS C 7021: B-10

Reference

Standard

LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

PART NO. LEY35162/R1

Page 5/5

LEY35162-R1 数据表(PDF) 6 Page - LIGITEK electronics co., ltd.

LEY35162-R1 数据表(HTML) 6 Page - LIGITEK electronics co., ltd.

Html Pages

1 2 3 4 5 6

数据表下载