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MPC8535EBVTATH 数据表(PDF) 109 Page - Freescale Semiconductor, Inc |
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MPC8535EBVTATH 数据表(HTML) 109 Page - Freescale Semiconductor, Inc |
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109 / 126 page  Thermal MPC8535E PowerQUICC™ III Integrated Processor Hardware Specifications, Rev. 2 Freescale Semiconductor 109 2.23.6 Frequency Options 2.23.6.1 SYSCLK to Platform Frequency Options Table 78 shows the expected frequency values for the platform frequency when using a CCB clock to SYSCLK ratio in comparison to the memory bus clock speed. 2.24 Thermal This section describes the thermal specifications of the MPC8535E. 2.24.1 Thermal Characteristics Table 79 provides the package thermal characteristics. Table 78. Frequency Options of SYSCLK with Respect to Memory Bus Speeds CCB to SYSCLK Ratio SYSCLK (MHz) 33.33 41.66 66.66 83 100 111 133.33 Platform /CCB Frequency (MHz) 3 333 400 4 333 400 444 5 333 415 500 6 400 500 8 333 10 333 417 12 400 500 Table 79. Package Thermal Characteristics Characteristic JEDEC Board Symbol Value Unit Notes Junction-to-ambient Natural Convection Single layer board (1s) RθJA 23 °C/W 1, 2 Junction-to-ambient Natural Convection Four layer board (2s2p) RθJA 18 °C/W 1, 2 Junction-to-ambient (@200 ft/min) Single layer board (1s) RθJA 18 °C/W 1, 2 |
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